Effect of Thermal Conductivity on Tracking Failure of Epoxy/BN Composite under Pulse Strength

Effect of Thermal Conductivity on Tracking Failure of Epoxy/BN Composite under Pulse Strength
复制标题

脉冲强度下热导率对环氧树脂/BN复合材料漏电起痕破坏的影响

DOI:
10.1109/tdei.2013.6451370
复制
发表时间:
2013-02-01
影响因子:
3.1
通讯作者:
Zhang, J. W.
Zhang, J. W.
中科院分区:
工程技术3区
文献类型:
--
作者:
Du, B. X.;Xiao, M.;Zhang, J. W.

文献摘要

被引文献

相似文献

环氧树脂(EX)的热传导能力较弱,但其绝缘性能优异,被广泛应用于电气器件的绝缘材料中。为环氧树脂获得高导热性的一种可能方法是使用无机填充材料。跟踪失效是聚合物表面典型的介电击穿性能。热导率与跟踪失效性能有关。本文试图阐明加入氮化硼(BN)颗粒是否可以通过提高环氧树脂的导热性来达到提高其抗跟踪失效性能的目的。在测试之前,用剪切力将BN颗粒分散到EX中制备样品。跟踪故障试验在室温下进行。讨论了热导率对跟踪失效时间、放电电流放电量和热照片的影响。结果表明,随着氮化硼颗粒浓度的增加,最高温度和放电量降低,但跟踪失效时间增加;实验结果表明,氮化硼颗粒的浓度对跟踪失败的结果起主要作用。氮化硼颗粒的填充提高了材料的抗跟踪性,这是由于导热性的提高。
Epoxy (EX) is widely used as insulating materials in electric devices with its excellent insulating properties in spite of its weak ability of thermal conduction. One possible way to obtain high thermal conductivity for Epoxy is the use of an inorganic filling material. Tracking failure is a typical dielectric breakdown performance on polymer surface. Thermal conductivity is associated with the tracking failure performance. In this paper, it is attempted to clarify whether the addition of Boron Nitride (BN) particles can achieve the aim of improving resistance to tracking failure of Epoxy by the way of increasing its thermal conductivity. Prior to test, samples were prepared by dispersing BN particles into EX with shear force. Tracking failure tests were performed at room temperature. The thermal conductivity effects on the time to tracking failure, the discharge quantity of discharge current and the thermal photographs were discussed. Obtained results show that with increasing the concentration of BN particles, the maximum temperature and the discharge quantity decrease, but the time to tracking failure increases. The experimental results suggest that the concentration of BN particles plays a main role in the result of the tracking failure. The resistance to tracking is improved by the filler of BN particles, which is due to the improvement of thermal conductivity.