Low-operating-energy directly modulated lasers for short-distance optical interconnects
Low-operating-energy directly modulated lasers for short-distance optical interconnects
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DOI：
10.1364/aop.10.000567
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发表时间：
2018-08
影响因子：
27.1
通讯作者：
S. Matsuo;T. Kakitsuka
中科院分区：
文献类型：
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作者：
S. Matsuo;T. Kakitsuka
本文综述了用于数据通信和计算机通信的低工作能量直接调制激光器（dml）的最新进展。关键问题是它们的运行能量和在这些应用中使用它们的成本。为了降低工作能量，在保持腔内q因子或光子寿命的同时减小激光器的有效体积是很重要的。因此，如何实现高反射率反射镜一直是降低操作能量的主要挑战。在激光器所需输出功率方面，需要输入光电探测器的功率和传输距离决定了激光器有效体积的下限。因此，运行能量和输出功率是一种权衡关系。在激光器设计中，腔体体积、量子阱数和光约束因子是关键参数。为了降低成本，重要的是要制造一个大规模的光子集成电路（PIC），包括dml，光多路复用器和监视光电探测器，因为较低的组装成本降低了总成本。在此背景下，硅（Si）光子学技术在低成本制造大规模PICs中发挥着关键作用，dml与硅光子学器件的异质集成备受关注。我们将描述在硅衬底上异质集成的制造技术和dml的实验结果。
We review recent developments in directly modulated lasers (DMLs) with low operating energy for datacom and computercom applications. Key issues are their operating energy and the cost for employing them in these applications. To decrease the operating energy, it is important to reduce the active volume of the laser while maintaining the cavity Q-factor or photon lifetime in the cavity. Therefore, how to achieve high-reflectivity mirrors has been the main challenge in reducing the operating energy. In terms of the required output power from the lasers, the required input power into the photodetector and the transmission distance determine the lower limit of laser active volume. Therefore, the operating energy and output power are in a trade-off relationship. In designing the lasers, the cavity volume, quantum well number, and optical confinement factor are critical parameters. For reducing the cost, it is important to fabricate a large-scale photonic integrated circuit (PIC) comprising DMLs, an optical multiplexer, and monitor photodetectors because the lower assembly cost reduces the overall cost. In this context, silicon (Si) photonics technology plays a key role in fabricating large-scale PICs with low cost, and heterogeneous integration of DMLs and Si photonics devices has attracted much attention. We will describe fabrication technologies for heterogeneous integration and experimental results for DMLs on a Si substrate.