Giant Vesicle Fusion on Microelectrodes Fabricated by Femtosecond Laser Ablation Followed by Synchrotron Radiation Etching
Giant Vesicle Fusion on Microelectrodes Fabricated by Femtosecond Laser Ablation Followed by Synchrotron Radiation Etching
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通过飞秒激光烧蚀和同步辐射蚀刻制造的微电极上的巨型囊泡融合
DOI：
10.1143/jjap.44.l1207
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发表时间：
2005
影响因子：
1.5
通讯作者：
T. Urisu
中科院分区：
文献类型：
--
作者：
M. Rahman;Y. Nonogaki;R. Tero;Yong‐Hoon Kim;H. Uno;Z. Zhang;T. Yano;M. Aoyama;Ryuichiro Sasaki;H. Nagai;M. Yoshida;T. Urisu
我们开发了一种新技术，可在 SiO2 (600 nm)/CoSi2 (10 nm)/Si 基板表面制造直径约 1 µm 的微电极孔（孔）。该工艺使得能够在保持SiO2表面原始纳米级平坦度（Ra∼0.8 nm）的同时制造电极孔。这些微电极上的巨大囊泡融合形成了脂质双层。荧光显微镜、原位原子力显微镜和电特性测量表明，成功制备了具有足够高电阻（千兆欧姆密封）的单个脂质双层。
We have developed a new technique for fabricating a hole (well) with a diameter of about 1 µm for a microelectrode on the surface of SiO2 (600 nm)/CoSi2 (10 nm)/Si substrate. This process enabled the fabrication of electrode holes while maintaining the original nanolevel flatness (Ra∼0.8 nm) of the SiO2 surface. A lipid bilayer was formed by giant vesicle fusion on these microelectrodes. Fluorescence microscope, in situ atomic force microscope and electrical characteristics measurements showed that a single lipid bilayer of sufficiently high resistance (gigaohm seal) was successfully fabricated.