Study on new float polishing with the MCF
Study on new float polishing with the MCF
复制标题
新型MCF浮法抛光研究
DOI：
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发表时间：
2007
影响因子：
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通讯作者：
Y. Zheng
中科院分区：
文献类型：
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作者：
K. Shimada;Y. Matsuo;K. Yamamoto;Y. Zheng
目的：作为之前论文 [1] 的延续，该报告展示了利用现有改进的磁性复合流体（MCF）进行浮法抛光的各种可能性。作者之一 Shimada 在 2001 年开发的 MCF 通过添加 α-纤维素进行了改进，从而实现了高达 8mm 的间隙，如另一篇论文所示 [1]。本文描述了使用 α-纤维素进行 MCF 浮法抛光技术应用的可能性。设计/方法/途径：首先，描述了MCF浮法抛光技术在不同抛光条件下获得的结果。这些条件包括抛光工具中使用的磁体的各种形状、磁场强度、α-纤维素的浓度、样品的运动、固定在抛光样品下方的磁体的存在以及初始表面粗糙度。其次，目前的MCF浮法抛光技术可用于多种类型的抛光，包括对丙烯酸树脂管的内表面进行抛光、通过使用轨道抛光工具对宽平面进行抛光、以及对三维复杂形状的所有表面进行同时浮法抛光。另外，作为其他示例，示出了集成电路(IC)基板上的抛光。研究结果：通过改变MCF浮法抛光技术的抛光条件，抛光效果会发生变化。另一方面，对于MCF浮法抛光的多种应用，可以抛光内表面、宽平面、粗糙初始表面、三维复杂形状和IC基板。研究局限性/意义：MCF浮法抛光技术在不同抛光条件下的数据有助于阐明当前抛光技术可能的实际应用。如之前的论文[1]所示，由于MCF含有长磁簇，因此目前的抛光技术可以实现大间隙的浮法抛光。因此，MCF浮法抛光在抛光领域的许多应用都是有用的。实际意义：本研究表明了抛光中的实际应用。独创性/价值：目前的MCF浮法抛光技术是浮法抛光领域的一项新技术。另外，还没有提出具有大间隙的普通浮法抛光技术。因此，本发明的纸在抛光领域非常有用。
Purpose: As a continuation of a previous paper [1], the report demonstrates the various possibilities of float polishing utilizing the present improved magnetic compound fluid (MCF). The MCF developed by one of authors, Shimada, in 2001, was improved by the addition of α-cellulose, thereby achieving a clearance as great as 8mm as shown in another paper [1]. The present paper describes the possibility of the application of the MCF float polishing technique with α-cellulose. Design/methodology/approach: First, the results obtained under various polishing conditions of the MCF float polishing technique are described. These conditions include the various shapes of the magnet employed in the polishing tool, magnetic field strength, the concentration of α-cellulose, the motion of the specimen, the existence of a magnet fixed underneath the polished specimen, and initial surface roughness. Secondly, the present MCF float polishing technique can be used in many types of polishing, including polishing the inner surface of an acrylic resin tube, a wide flat surface through the use of a orbital polishing tool, and simultaneous float polishing of all surfaces of a three-dimensional complex shape. In addition, as other examples, the polishing on the integrated circuit (IC) substrate is shown. Findings: By the various polishing conditions of the MCF float polishing technique, the polishing effect is changed. On the other hand, as for the many applications of the MCF float polishing, inner surface, wide flat surface, rough initial surface, three-dimensional complex shape and IC substrate can be polished. Research limitations/implications: The data under various polishing conditions of the MCF float polishing technique helps to clarify the present polishing technique’s possible practical applications. As shown in a previous paper [1], since MCF contains long magnetic clusters, the present polishing technique allows float polishing with large clearance. Therefore, many applications of the MCF float polishing are useful in the polishing fields. Practical implications: The present study indicates the practical application in the polishing. Originality/value: The present technique of MCF float polishing is new in the field of float polishing. In addition, the ordinary float polishing technique having large clearance has not been proposed. Therefore, the present paper is very useful in the polishing field.