Effects of bonding temperature on the microstructures and mechanical properties of the C/C-Cf/SiC composite joint prepared by in situ hot-press diffusion bonding using Ti-Si-C compound as interlayer
Effects of bonding temperature on the microstructures and mechanical properties of the C/C-Cf/SiC composite joint prepared by in situ hot-press diffusion bonding using Ti-Si-C compound as interlayer
复制标题
接合温度对Ti-Si-C化合物为中间层原位热压扩散接合C/C-Cf/SiC复合材料接头显微组织和力学性能的影响
DOI：
10.1088/2053-1591/ab5016
复制
发表时间：
2019
影响因子：
2.3
通讯作者：
Yang Haotian
中科院分区：
文献类型：
--
作者：
Wang Jie;Xiong Yanlin;Li Hao;Yang Guanzhong;Zhang Fuqi;Xiong Qinglian;Feng Yang;Yang Haotian
以Ti-Si-C混合粉末为连接材料，采用原位热压扩散连接技术将C/C复合材料连接到Cf/SiC复合材料上。研究了连接温度对C/CCf/SiC复合材料接头组织和力学性能的影响。剪切试验结果表明，在1550 ℃保温60 min的接头具有最大的剪切强度（11.1±1.1 MPa），其中致密的中间层、强有力的界面连接和“钉效应”是接头力学性能优异的原因。剪切断口形貌和断裂行为分析结果表明，断裂发生在C/C复合材料/中间层的界面区，并向中间层延伸，C/CC f/SiC复合材料接头具有韧性断裂特征。
Using Ti–Si–C mixed powder as bonding material, C/C composite was bonded to C f/SiC composite by in situ hot-press diffusion bonding. Effects of bonding temperature on the microstructures and mechanical properties of the C/CC f/SiC composite joint were investigated. The shear test result showed that the joint obtained at 1550 C for 60 min has the maximum shear strength (11.1±1.1 MPa), in which compacted interlayer, powerful interface joining and'nail effect'can be responsible for the outstanding mechanical properties of joint. Moreover, the analysis result of shear fracture morphology and fractural behavior displayed that the fracture happens in the interface area of C/C composite/interlayer and extends into the interlayer area, as well as some ductile fractural features present in the C/CC f/SiC composite joints.