Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates
Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates
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DOI:
10.1002/admt.201700250
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发表时间:
2018-04-01
影响因子:
6.8
通讯作者:
Griesser, Thomas
中科院分区:
文献类型:
--
作者:
Samusjew, Aleksandra;Lassnig, Alice;Griesser, Thomas
Cellulose foil is a biodegradable and carbon neutral material that is a poor substrate for most conductive silver inks. Herein, it is reported that a simple solution of silver acetate in 1-methylimidazole can be used to produce conductive patterns on a commercial packaging foil that is composed almost exclusively from cellulose. The reduction can be carried out thermally or by irradiation with UV light. In the latter case, the printed pattern may become conductive on both sides of the substrate and also exhibits conductivity across the cellulose foil, giving rise to fully printed vertical interconnect access. Control experiments confirm that the cellulose plays a crucial role in completing the reduction of the silver salt, obtaining conductive patterns.