Analysis of thermoelectric cooler performance for high power electronic packages
Analysis of thermoelectric cooler performance for high power electronic packages
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DOI：
10.1016/j.applthermaleng.2009.10.020
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发表时间：
2010-05-01
影响因子：
6.4
通讯作者：
Tarin, M.
中科院分区：
文献类型：
--
作者：
Zhang, H. Y.;Mui, Y. C.;Tarin, M.
针对处理器等大功率电子封装，对热电制冷器(TEC)的性能进行了分析。基于TEC模块参数，推导出了系统约束下TEC在固定制冷功率Q(C)下结温T-j和固定T-j下结温Q(C)的两组解析解。与文献中经常报道的迭代方法相比，本解析法的主要优点在于无需借助颗粒热电参数和几何细节即可获得解。在现有分析模型的基础上，针对两个额定高制冷功率的商用TEC，分析了处理器测试和终端用户条件下的处理器冷却两种方案。分析结果表明，基于优化的电流和冷却配置，可以实现显著的热增强。通过实验测量和与已有解的比较，验证了本文分析的正确性。(C)2009爱思唯尔有限公司。保留所有权利。
In this paper, an analysis of thermoelectric cooler (TEC) performance is conducted for high power electronic packages such as processors. Based on the TEC module parameters, two sets of analytical solutions for TECs in system constraints are derived for the junction temperature T-j at a fixed cooling power Q(c), and for Q(c) at a fixed T-j, respectively. As against the iterative procedure often reported in literature, the major advantage of the present analytical method lies in the fact that the solutions can be obtained without resorting to the pellet thermoelectric parameters and geometric details. Two cooling scenarios, the processor test and the processor cooling under end-user conditions, are analyzed based on the present analysis models for two commercial TECs with high cooling power capacities nominal. Analytical results show that significant thermal enhancements are achievable based on optimized currents and cooling configurations. The validation of the present analysis is also conducted through experimental measurements and comparison with previous solutions. (C) 2009 Elsevier Ltd. All rights reserved.