Corrosion behaviour assessment of lead-free Sn–Ag–M (M = In, Bi, Cu) solder alloys
Corrosion behaviour assessment of lead-free Sn–Ag–M (M = In, Bi, Cu) solder alloys
复制标题
DOI：
10.1016/j.matchemphys.2007.12.006
复制
发表时间：
2008-06
影响因子：
4.6
通讯作者：
F. Rosalbino;E. Angelini;G. Zanicchi;R. Marazza
中科院分区：
文献类型：
--
作者：
F. Rosalbino;E. Angelini;G. Zanicchi;R. Marazza
研究了无铅Sn88.7Ag2.3In9.0、Sn86.6Ag3.0Bi10.4、Sn96.1Ag3.1Cu0.8和Sn90.4Ag2.9Cu6.7焊料在0.1M氯化钠溶液中的腐蚀行为，并与常规共晶Sn73.9Pb26.1焊料的腐蚀行为进行了比较。采用扫描电子显微镜(SEM)和电子探针分析(EPMA)对样品进行了表征。动电位极化曲线表明，与Sn73.9Pb26.1相比，Sn88.7Ag2.3In9.0和Sn86.6Ag3.0Bi10.4焊料的腐蚀性能较差。与Sn73.9Pb26.1焊料相比，铜的加入提高了Sn73.9Pb26.1焊料合金的耐蚀性，表现出更好的钝化行为。当铜含量从0.8at%增加到6.7at%时，锡-银焊料的腐蚀性能得到显著改善。经过电化学测试后，所有被考察的合金的表面都检测到了氯化锡的存在。此外，在Sn88.7Ag2.3In9.0焊料合金中也观察到了氯氧化铟。
The corrosion behaviour of lead-free Sn88.7Ag2.3In9.0, Sn86.6Ag3.0Bi10.4, Sn96.1Ag3.1Cu0.8and Sn90.4Ag2.9Cu6.7solder alloys was investigated in 0.1M NaCl solution and compared with that of the conventional eutectic Sn73.9Pb26.1solder. Scanning electron microscopy (SEM) and electron probe microanalysis (EPMA) were used to characterize the samples prior and after the electrochemical tests. Potentiodynamic polarization curves show that Sn88.7Ag2.3In9.0and Sn86.6Ag3.0Bi10.4solders exhibit poor corrosion behaviour compared to that of Sn73.9Pb26.1. On the contrary, copper addition enhances the corrosion resistance of Sn–Ag solder alloys which exhibit improved passivity behaviour compared to Sn73.9Pb26.1solder. Moreover, increasing the copper content from 0.8 to 6.7at% results in a significant improvement of the corrosion behaviour of Sn–Ag solders. The presence of tin oxychlorides were detected at the surface of all the alloys investigated after the electrochemical tests. In addition, indium oxychlorides were also observed in the Sn88.7Ag2.3In9.0solder alloy.