A liquid-based system for CPU cooling implementing a jet array impingement waterblock and a tube array remote heat exchanger
A liquid-based system for CPU cooling implementing a jet array impingement waterblock and a tube array remote heat exchanger
复制标题
DOI：
10.1016/j.applthermaleng.2012.01.013
复制
发表时间：
2012-06
影响因子：
6.4
通讯作者：
B. Whelan;R. Kempers;A. Robinson
中科院分区：
文献类型：
--
作者：
B. Whelan;R. Kempers;A. Robinson
设计并测试了一种液体CPU冷却器，其目标是在8.24 cm 2的表面积上实现200 W的冷却能力，与英特尔®奔腾®4处理器的集成散热器尺寸相称。该设计的主要目的是开发可以简单制造且具有成本效益的热硬件组件。为此，采用了微型喷射阵列水块和管束远程热交换器，因为它们的壳体的大部分可以使用低成本注塑成型技术制造，与传统单元相比，这可以显著降低总系统成本。该系统能够消散所需的热负荷，并表现出0.18 K/W的总热阻，需要约1.5 W的液压功率。在最大功率下，芯片与空气的温差为45 °C，这充分接近典型的设计阈值。同时还讨论了功率负载和液体体积流量的影响。
A liquid CPU cooler has been designed and tested with the aim to achieve a cooling capacity of 200 W for a surface area of 8.24 cm2, commensurate with the integrated heat spreader dimensions of an Intel®Pentium®4 Processor. The primary aim of the design was to develop thermal hardware components that can be manufactured simply and cost effectively. To this end, a miniature jet array waterblock and a tube bundle remote heat exchanger were employed since the bulk of their housings could be manufactured using low cost injection molding techniques which could significantly reduce the total system cost compared with conventional units. The system was capable of dissipating the required heat load and exhibited an overall thermal resistance of 0.18 K/W requiring approximately 1.5 W of hydraulic power. At maximum power the chip-to-air temperature difference was 45 °C which is adequately close to typical design thresholds. The influences of power loading and liquid volumetric flow rate are also discussed.