A molecular dynamics investigation into the mechanisms of subsurface damage and material removal of monocrystalline copper subjected to nanoscale high speed grinding
A molecular dynamics investigation into the mechanisms of subsurface damage and material removal of monocrystalline copper subjected to nanoscale high speed grinding
复制标题
纳米级高速研磨单晶铜亚表面损伤和材料去除机制的分子动力学研究
DOI：
10.1016/j.apsusc.2014.02.178
复制
发表时间：
2014-06-01
影响因子：
6.7
通讯作者：
Zhang, Liangchi
中科院分区：
文献类型：
--
作者：
Li, Jia;Fang, Qihong;Zhang, Liangchi
研究了纳米金刚石刀头高速磨削单晶铜时的亚表面损伤和材料去除机理。分析进行了三维分子动力学模拟的援助。通过对切屑、位错运动和工件变形的分析，探讨了影响材料变形的关键因素，包括磨削速度、切削深度、栅尖半径、铜的晶体取向和加工角度。建立了预测纳米级高速磨削过程中部分位错发射的解析模型。研究表明，较高的磨削速度、较大的刀尖半径或较大的切削深度都会导致较大的切屑体积和较大的工件温升。较低的研磨速度将产生更多的本征层错。变形机制的转变取决于位错与形变孪晶之间的竞争。存在一个临界加工角度，在该角度下，较高的速度、较小的刀尖半径或较小的切削深度将减少亚表面损伤并提高磨削表面的光滑度。所建立的解析模型表明，当晶体取向为（0 0 1）[1 0 0]时，最容易发生Shockley位错发射。皇冠版权所有（C）2014由Elsevier B发布。V.保留所有权利。
This paper investigates the mechanisms of subsurface damage and material removal of monocrystalline copper when it is under a nanoscale high speed grinding of a diamond tip. The analysis was carried outwith the aid of three-dimensional molecular dynamics simulations. The key factors that would influence the deformation of the material were carefully explored by analyzing the chip, dislocation movement, and workpiece deformation, which include grinding speed, depth of cut, grid tip radius, crystal orientation and machining angle of copper. An analytical model was also established to predict the emission of partial dislocations during the nanoscale high speed grinding. The investigation showed that a higher grinding velocity, a larger tip radius or a larger depth of cut would result in a larger chipping volume and a greater temperature rise in the copper workpiece. A lower grinding velocity would produce more intrinsic stacking faults. It was also found that the transition of deformation mechanisms depends on the competition between the dislocations and deformation twinning. There is a critical machining angle, at which a higher velocity, a smaller tip radius, or a smaller depth of cut will reduce the subsurface damage and improve the smoothness of a ground surface. The established analytical model showed that the Shockley dislocation emission is most likely to occur with the crystal orientations of (0 0 1)[1 0 0] at 45 degrees angle. Crown Copyright (C) 2014 Published by Elsevier B. V. All rights reserved.