Build plate conduction cooling for thermal management of wire arc additive manufactured components
Build plate conduction cooling for thermal management of wire arc additive manufactured components
复制标题
用于电弧增材制造组件热管理的构建板传导冷却
DOI：
10.1007/s00170-022-10558-9
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发表时间：
2022
期刊：
影响因子：
--
通讯作者：
Christopher Saldaña
中科院分区：
文献类型：
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作者：
Laurent Heinrich;T. Feldhausen;K. Saleeby;Thomas Kurfess;Christopher Saldaña
线弧增材制造（WAAM）允许以快速的沉积速率快速制造大型部件，同时利用比金属粉末便宜得多的现成线材原料。然而，该工艺的增加的沉积速率需要增强的热管理，因为可能由于过热而发生故障。缓解过热的常见策略是在各个层之间停留或暂停;然而，这会显著增加构建时间，并消除增材制造能够快速制造组件的优势。为了帮助缓解这一问题，本研究探讨了使用主动冷却来保持过程控制并减少总体构建时间。探索了施加到印刷基底的底部或侧面的传导冷却。本研究的结果表明，底部构建板主动冷却可用于将停留时间减少高达50%，并将构建过程后冷却至室温的时间减少高达75%。从这项研究的结果表明，使用主动冷却策略WAAM可以用于更好的热控制的过程中，应该进一步研究。
Wire arc additive manufacturing (WAAM) allows for quick, large component manufacturing with fast deposition rates while leveraging readily available wire feedstock that is significantly cheaper than metal powder. However, the increased deposition rate of this process requires enhanced thermal management as failures can occur due to overheating. A common strategy to mitigate overheating is to dwell, or pause, between individual layers; however, this can significantly increase build times and eliminate the advantage of additive manufacturing being able to manufacture components quickly. To help mitigate this issue, this study explores the use of active cooling to maintain process control and to decrease overall build time. Conductive cooling applied to either the bottom or side of the print substrate was explored. Results from this study showed that bottom build plate active cooling can be used to decrease dwell times by up to 50% and decrease cool-down to room temperature after the building process by up to 75%. Results from this study demonstrate that the use of active cooling strategies for WAAM can be used for better thermal control over the process and should be further investigated.