Frontal Polymerization of Thin Layers on a Thermally Insulating Substrate
Frontal Polymerization of Thin Layers on a Thermally Insulating Substrate
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DOI：
10.1021/acsapm.2c00497
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发表时间：
2022-06-10
影响因子：
5
通讯作者：
Geubelle, Philippe H.
中科院分区：
文献类型：
--
作者：
Gao, Yuan;Koett, Luis E. Rodriguez;Geubelle, Philippe H.
由于使用正面聚合技术制造厚度低至100 μ m的薄层，我们通过数值和实验研究了放热聚合与基板热损失之间的相互作用。结果表明，反应扩散功率平衡对聚合前沿速度和温度的影响。薄层的厚度下限取决于树脂的固化动力学和基材的热性能，并由标度定律描述。同时，薄层正面聚合实验证实了正面-衬底相互作用对正面传播和聚合层极限厚度的影响。本研究提供了薄层正面聚合中树脂-衬底相互作用的基本理解，并提供了功能性薄聚合物部件和树脂涂层制造中层的极限厚度的定量描述。
Motivated by the use of frontal polymerization for the manufacturing of thin layers with thickness down to similar to 100 mu m, we numerically and experimentally investigate the interplay between the exothermic polymerization and the heat losses to the substrate. The results show how the reaction-diffusion power balance affects the velocity and temperature of the polymerization front. The lower thickness limit of the thin layer depends on the cure kinetics of the resin and the thermal properties of the substrate and is described by a scaling law. Concurrently, thin-layer frontal polymerization experiments confirm the effects of front-substrate interaction on the front propagation and the limiting thickness of the polymerized layer. The present study offers a fundamental understanding of the resin-substrate interplay in thin-layer frontal polymerization and provides a quantitative description of the limiting thickness of the layer in the fabrication of functional thin polymeric parts and resin coatings.