Electrodeposition of Copper at Well-Defined Pt(111) and Rh(111) Electrodes in Sulfuric Acid Solutions: Studying with In Situ Scanning Tunneling Microscopy
Electrodeposition of Copper at Well-Defined Pt(111) and Rh(111) Electrodes in Sulfuric Acid Solutions: Studying with In Situ Scanning Tunneling Microscopy
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硫酸溶液中明确定义的 Pt(111) 和 Rh(111) 电极上的铜电沉积:用原位扫描隧道显微镜研究
DOI:
10.1021/la9912242
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发表时间:
2000
期刊:
影响因子:
--
通讯作者:
S. Yau
中科院分区:
文献类型:
--
作者:
Zeli Wu;A. Zang;S. Yau
We report in situ scanning tunneling microscopy (STM) results of underpotential deposition (UPD) of copper at well-ordered Pt(111) and Rh(111) electrodes in sulfuric acid solutions. Cyclic voltammograms of Pt(111) at 1 mV/s in 0.05 M H2SO4 and 5 mM CuSO4 reveal two well-defined UPD peaks at 0.65 and 0.61 V, whereas one doublet UPD peak at 0.44 V is observed for Rh(111). Real-time STM imaging revealed that the two sharp UPD features for Pt(111) correspond to the formation of a (√3 × √3)R30° structure and a disorder phase, respectively. A long-range ordered (√3 × √7)oblique structure was imaged after a full monolayer of Cu was deposited, tentatively assigned to the (bi)sulfate anions lying atop the Cu adlayer. In contrast, a monolayer of Cu was deposited in a single step on Rh(111), where (bi)sulfate anions also actively participated in the process. In situ STM revealed a well-ordered (√3 × √7)oblique structure throughout the deposition process, likely because of the coadsorbed (bi)sulfate anions. A series ...