A Survey of Chip-level Thermal Simulators
A Survey of Chip-level Thermal Simulators
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DOI：
10.1145/3309544
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发表时间：
2019-04
期刊：
影响因子：
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通讯作者：
Hameedah Sultan;A. Chauhan;S. Sarangi
中科院分区：
文献类型：
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作者：
Hameedah Sultan;A. Chauhan;S. Sarangi
近年来，由于高性能微处理器功率密度的增加，热建模和仿真变得势在必行。温度是一阶设计准则，因此在设计过程的每个阶段都必须特别考虑它。如果不适当地考虑，温度可能对芯片的性能产生灾难性的影响，通常导致故障。为了简化研究工作，有一个强烈的需要进行全面调查的技术和工具，可用于热模拟。这将有助于新进入该领域的研究人员快速熟悉最新技术，并使现有研究人员能够进一步改进他们提出的技术。在这篇文章中，我们提出了一个调查的封装级热模拟技术在过去的二十年中发展。
Thermal modeling and simulation have become imperative in recent years owing to the increased power density of high performance microprocessors. Temperature is a first-order design criteria, and hence special consideration has to be given to it in every stage of the design process. If not properly accounted for, temperature can have disastrous effects on the performance of the chip, often leading to failure. To streamline research efforts, there is a strong need for a comprehensive survey of the techniques and tools available for thermal simulation. This will help new researchers entering the field to quickly familiarize themselves with the state of the art and enable existing researchers to further improve upon their proposed techniques. In this article, we present a survey of the package level thermal simulation techniques developed over the past two decades.