The Design Optimization of the Dielectric Assist Accelerating Structure for Better Heat and Gas Transfer
The Design Optimization of the Dielectric Assist Accelerating Structure for Better Heat and Gas Transfer
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DOI：
10.18429/jacow-ipac2019-tuxxpls3
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发表时间：
2019-06
期刊：
影响因子：
--
通讯作者：
S. Mori;D. Sato;M. Yoshida
中科院分区：
文献类型：
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作者：
S. Mori;D. Sato;M. Yoshida
介电辅助加速（DAA）结构是一种在室温下提供高Q值的介电插入正导腔。该加速结构由介电盘和插在铜腔中的介电圆柱层组成。在实际操作中，尚未考虑电介质单元的散热和圆柱形层内气体的真空抽放。为了解决这些问题，我们提出了将介质盘的延伸部分嵌入铜腔并采用扼流圈结构的DAA结构优化设计。我们给出了扩展DAA结构的电磁场模拟结果和热模拟结果，以阐明占空因子与介质电池最高温度之间的关系。
The dielectric-assist accelerating (DAA) structure is a dielectric-inserted normal-conducting cavity, which provides high Q value at room temperature. This accelerating structure is composed of dielectric disks and a dielectric cylindrical layer inserted in a copper cavity. For the realistic operation, the removal of heat from the dielectric cells and the vacuum evacuation of gas inside the cylindrical layers have not considered yet. In order to solve the problems, we propose the optimized design of the DAA structure, where the extended part of the dielectric disk is embedded in the copper cavity and the choke structure is applied. We show the result of the electromagnetic-field simulation of the extended DAA structure and the thermal simulation to clarify the relation between a duty factor and maximum temperature of the dielectric cells.