Thermal Simulation of Processing-in-Memory Devices using HotSpot 7.0
Thermal Simulation of Processing-in-Memory Devices using HotSpot 7.0
复制标题
使用 HotSpot 7.0 对内存处理设备进行热仿真
DOI：
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发表时间：
2021
期刊：
影响因子：
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通讯作者：
Mircea R. Stan
中科院分区：
文献类型：
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作者：
Jun;R. West;K. Skadron;Mircea R. Stan
3D集成电路（3D IC）相对于2D集成电路具有许多优势，例如更高的带宽和能效，这导致了HBM和HMC等商业产品的普及。然而，它们也有众所周知的热挑战，需要在与高性能处理器或内存处理（PIM）集成之前解决。微流体冷却是解决这些热挑战的一个很有前途的解决方案，但其相关的设计空间足够大和复杂，我们需要一个设计空间探索工具。我们扩展热点，现有的热模拟器，以支持灵活的建模和模拟微流体冷却设计。我们相信，该工具将有助于研究新型微流体冷却技术，最终实现更高性能的3D IC，同时减少热约束。
3D Integrated Circuits (3D ICs) offer many advantages over their 2D counterparts, such as increased bandwidth and energy efficiency, that has lead to the popularity of commercial products such as HBM and HMC. However, they also have well-known thermal challenges that need to be resolved before they can be integrated with high performance processors or Processing in Memory (PIM). Microfluidic cooling is a promising solution to these thermal challenges, but its associated design space is large enough and complex enough that we need a design space exploration tool. We extend HotSpot, an existing thermal simulator, to support flexible modeling and simulation of microfluidic cooling designs. We believe this tool will enable research into novel microfluidic cooling techniques, ultimately resulting in higher performance 3D ICs with reduced thermal constraints.