Optimizing Sensor Count and Placement to Detect Bond Wire Lift-offs and Surface Defects in High-Power IGBT Modules using Low-Cost Piezo-electric Resonators
Optimizing Sensor Count and Placement to Detect Bond Wire Lift-offs and Surface Defects in High-Power IGBT Modules using Low-Cost Piezo-electric Resonators
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DOI：
10.1109/ecce50734.2022.9947859
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发表时间：
2022-10
期刊：
影响因子：
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通讯作者：
Tohfa Haque;A. Hanif;Faisal Khan
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文献类型：
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作者：
Tohfa Haque;A. Hanif;Faisal Khan
本文介绍了在大功率绝缘栅双极结型晶体管（IGBT）模块中识别键合线剥离和表面缺陷的最新结果和发现。该手稿的作者以前提出了一种低成本的基于压电谐振器的测量单元，用于检测较大IGBT模块中与键合线相关的退化。由于高功率IGBT模块是昂贵的，很明显，评估我们提出的方法，通过诱导控制损坏新的（新的）IGBT可能不符合成本效益，特别是当多组数据需要通过诱导损坏不同的水平被捕获。为了克服这一限制，已经使用3D打印外壳、PCB和铜线来模拟IGBT键合线，其尺寸非常接近于真实的IGBT。使用这种方法，可以以真实的IGBT为代价构建多个测试设备，并且所提出的技术可以在不损坏昂贵的真实的IGBT的情况下进行微调。我们最近的研究结果可以用来确定真实的IGBT退化和键合线剥离使用只有两个传感器，而不是六个传感器中使用的第一次迭代的设置。除了优化传感器数量，我们还通过尝试在IGBT外壳内进行多个放置，确定了这些传感器的最佳可能位置。
This manuscript presents the most recent results and findings to identify bond wire lift-offs and surface defects in high-power isolated gate bipolar junction transistor (IGBT) modules. The authors of this manuscript formerly proposed a low-cost, piezoelectric resonator-based measurement unit to detect bond wire related degradation in larger IGBT modules. Since high-power IGBT modules are expensive, it was apparent that evaluating our proposed method by inducing controlled damage to fresh (new) IGBTs may not be cost-effective especially when multiple sets of data need to be captured by inducing damage to different levels. In order to overcome this limitation, IGBT bond wires have been mimicked using a 3D printed enclosure, a PCB, and copper wires with dimensions very closely resembling a real IGBT. Using this method, multiple test devices can be built at the cost of a real IGBT, and the proposed technique could be fine-tuned without damaging expensive, real IGBTs. Our recent findings can be used to determine real IGBT degradation and bond wire lift-offs using only two sensors, as opposed to six transducers used in the first iteration of the setup. In addition to optimizing the sensor count, we have also identified the best possible locations of these sensors by attempting multiple placements inside the IGBT casing.