Dynamic On-Chip Thermal Optimization for Three-Dimensional Networks-On-Chip
Dynamic On-Chip Thermal Optimization for Three-Dimensional Networks-On-Chip
复制标题
三维片上网络的动态片上热优化
DOI：
10.1093/comjnl/bxs135
复制
发表时间：
2012
期刊：
影响因子：
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通讯作者：
Al-Dujaily R
中科院分区：
文献类型：
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作者：
Al-Dujaily R
复杂的热行为阻碍了三维（3D）超大规模集成系统的发展。特别是，基于高密度硅通孔的集成可能导致超高温热点和永久性硅器件损坏。在本文中，我们引入了一种自适应策略，以有效地扩散整个3D几何形状的热量。该策略采用动态规划网络来选择和优化片上网络（NoC）中的数据操纵方向。我们还开发了一个工具，它是基于精确的HotSpot热模型和SystemC循环精确模型，模拟热系统和评估我们的方法。我们发现，所提出的方法可以显着扩散的热点从3D几何形状和整体温度可以显着降低。给定相同的热约束，自适应NoC的吞吐量性能也可以得到改善。这项工作为探索未来大规模3D集成的片上适应性提供了一条新的途径。
The complex thermal behaviour prohibits the advancement of three-dimensional (3D) very-large-scale integration system. Particularly, the high-density through-silicon via based integration could lead to ultra-high temperature hotspots and permanent silicon device damage. In this paper, we introduce an adaptive strategy to effectively diffuse heat throughout the 3D geometry. This strategy employs a dynamic programming network to select and optimize the direction of data manoeuvre in a network-on-chip (NoC). We also developed a tool, which is based on the accurate HotSpot thermal model and SystemC cycle accurate model, to simulate the thermal system and evaluate our approach. We found that the proposed approach can significantly diffuse the hotspots from a 3D geometry and overall temperature can be significantly reduced. Given the same thermal constraints, the throughput performance of an adaptive NoC can also be improved. This work enables a new avenue to explore the on-chip adaptability for the future large-scale 3D integration.
用于片上温度检测的高灵敏度、宽检测范围 MOS 隧道温度传感器
DOI：
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发表时间：
2004
期刊：
影响因子：
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作者：
Y. Shih;Shian;Tsung;J. Hwu
通讯作者：
J. Hwu