The wear mechanism of silicon nitride in rolling-sliding contact☆
The wear mechanism of silicon nitride in rolling-sliding contact☆
复制标题
氮化硅滚动滑动接触磨损机理☆
DOI：
10.1016/0043-1648(91)90256-t
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发表时间：
1991
期刊：
影响因子：
5
通讯作者：
K. Katô
中科院分区：
文献类型：
--
作者：
K. Adachi;K. Hokkirigawa;K. Katô
利用环对环试验机研究了氮化硅在无润滑滚动-滑动接触条件下的微观磨损机理。通过改变接触应力和剪应力的组合，使切向系数φ从0.04变为0.89，滑移率从0%变为100%。在此条件下获得的磨损系数K值为10−7~10−3。磨损系数随切向系数和滑移率的增大而增大。磨损系数的急剧变化与微观磨损模式的变化密切相关，扫描电子显微镜观察磨损表面的变化十分明显。当S<；10%和φ>；0.3时，磨损表面变得非常粗糙，有许多裂纹和剥落的痕迹，K大于10−5。对于S<；10%和φ>；0.3时，磨损表面出现了与孔尺寸相似的部分断裂，Kis约为10−6。
The microscopic wear mechanism of silicon nitride in unlubricated rolling-sliding contact was investigated by using a ring-on-ring-type test machine at room temperature. The tangential coefficient φ was changed from 0.04 to 0.89 and the slip ratioSwas changed from 0% to 100% by changing the combination of contact stress and shear stress. With these conditions the value of the wear coefficientKobtained was of the order of 10−7to 10−3.The wear coefficient increases with increasing tangential coefficient and increasing slip ratio. The observed drastic change in wear coefficient related closely to the change in microscopic wear mode, which was evident by inspection of the wear surface with a scanning electron microscope.ForS> 10% the wear surface became very rough and showed many cracks and marks of delamination of flakes, andKwas larger than 10−5. ForS< 10% andφ>0.3 the wear surface showed partial fracture on a scale similar to the pore size andKwas of the order of 10−6. ForS< 10% andφ<0.3 the wear surface clearly retained the initial pores, cracking was not observed andKwas less than 10−6.