Mold-assisted near-field optical lithography

Mold-assisted near-field optical lithography
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DOI:
10.1016/s0167-9317(99)00017-9
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发表时间:
1999-05-01
影响因子:
2.3
通讯作者:
Launois, H
Launois, H
中科院分区:
工程技术3区
文献类型:
--
作者:
Chen, Y;Carcenac, F;Launois, H

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提出了一种基于近场光聚合的模具辅助光刻新方法。除了数值分析,我们还提出了模具制造和复制的子100纳米功能。该模具是通过电子束光刻和反应离子蚀刻的熔融石英基板覆盖的薄膜吸收剂盖层。在将模具轻轻压入光固化单体膜中之后进行曝光。由于模具和近场光学限制,所得有机层不仅提供厚度对比度,而且提供材料组成对比度,即,未掩蔽区域中的聚合物和掩蔽部分中的单体。
We describe a new approach of mold-assisted lithography based on photopolymerization under near-field regime. In addition to a numerical analysis, we also present the mold fabrication and the replication of sub-100 nm features. The molds were fabricated by electron beam lithography and reactive ion etching of a fused silica substrate covered by a thin film absorber cap layer. Exposures were done after gently pressing the mold into a light curable monomer film. Because of the mold and near-field optical confinements, the resulted organic layer provides not only a thickness contrast but also a material composition contrast, i.e., polymer in unmasked area and monomer in masked parts.