Planarized Nb 4-Layer Fabrication Process for Superconducting Integrated Circuits and Its Fabricated Device Evaluation
Planarized Nb 4-Layer Fabrication Process for Superconducting Integrated Circuits and Its Fabricated Device Evaluation
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超导集成电路平面化铌四层制造工艺及其制造器件评估
DOI：
10.1587/transele.2020sup0001
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发表时间：
2021
影响因子：
0.5
通讯作者：
FUJIMAKI Akira
中科院分区：
文献类型：
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作者：
NAGASAWA Shuichi;TANAKA Masamitsu;TAKEUCHI Naoki;YAMANASHI Yuki;MIYAJIMA Shigeyuki;CHINA Fumihiro;YAMAE Taiki;YAMAZAKI Koki;SOMEI Yuta;SEGA Naonori;MIZUGAKI Yoshinao;MYOREN Hiroaki;TERAI Hirotaka;HIDAKA Mutsuo;YOSHIKAWA Nobuyuki;FUJIMAKI Akira
