Ink-Coated Silver Films on PET for Flexible, High Performance Electromagnetic Interference Shielding and Joule Heating
Ink-Coated Silver Films on PET for Flexible, High Performance Electromagnetic Interference Shielding and Joule Heating
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DOI：
10.1021/acsaelm.2c01183
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发表时间：
2022-12-23
影响因子：
4.7
通讯作者：
Leu, Paul W.
中科院分区：
文献类型：
--
作者：
Li, Mingxuan;Sinha, Sneh;Leu, Paul W.
需要可结合到柔性衬底中的高效电磁干扰(EMI)屏蔽和高效焦耳加热材料。在这项工作中，我们展示了在聚对苯二甲酸乙二醇酯上制备的银膜，其方阻为57Mohm/sq，在X波段(8-12 GHz)和Ku波段(12-18 GHz)的电磁屏蔽效率分别为82.6dB和85.3dB，并且在1.5V直流输入下具有高焦耳加热性能，温度稳定在147.0摄氏度。银膜是使用仅在100℃固化的活性颗粒无银油墨和聚氨酯二醇(PUD)来增强与PET的附着力而制成的。PUD具有极佳的机械灵活性，在0.4厘米弯曲半径下进行10,000次弯曲后，EMI屏蔽效率不会降低。这项工作获得了高的EMI SE，小的薄膜厚度仅为11.7微米，并且在低外加电压下具有稳定的高温，这两者都是很难实现的。这项工作展示了在PET上镀银薄膜作为一种灵活的材料，用于有效的EMI屏蔽保护和焦耳加热，可用于智能可穿戴设备、个人医疗电子设备和下一代通信。
There is a need for high efficiency electromagnetic interference (EMI) shielding and highly efficient joule heating materials that may be incorporated into flexible substrates. In this work, we demonstrate silver films on polyethylene terephthalate (PET) with a low sheet resistance of 57 mohm/sq, high EMI shielding efficiency of 82.6 dB in the X band (8-12 GHz) and 85.3 dB in the Ku band (12-18 GHz), and high Joule heating performance with a stable temperature of 147.0 degrees C at only 1.5 V DC power input. The silver films are fabricated using a reactive particle free silver ink, which is cured at only 100 degrees C, and polyurethane diol (PUD) is utilized to enhance adhesion to PET. The PUD enables excellent mechanical flexibility, where the EMI shielding efficiency does not degrade after 10 000 times bending at a 0.4 cm bending radius. This work achieves high EMI SE with small film thickness of only 11.7 mu m and stable high temperatures at low applied voltage, both of which have been difficult to achieve. This work demonstrates coated silver thin films on PET as a a flexible material for efficient EMI shielding protection and Joule heating that may be used for smart wearable devices, personal medical electronics, and next generation communications.KEYWORDS: EMI shielding, metal ink, flexible electronics, Joule heating, additive manufacturing