Design of substrate integrated gap waveguide

Design of substrate integrated gap waveguide
复制标题

DOI:
10.1109/mwsym.2016.7540186
复制
发表时间:
2016-05
期刊:
2016 IEEE MTT-S International Microwave Symposium (IMS)
影响因子:
--
通讯作者:
Jing Zhang;Xiupu Zhang;Dongya Shen
Jing Zhang;Xiupu Zhang;Dongya Shen
中科院分区:
其他
文献类型:
--
作者:
Jing Zhang;Xiupu Zhang;Dongya Shen

文献摘要

被引文献

相似文献

为了简化传统的气隙波导,提出了一种基片集成气隙波导。此外,该方法弥补了微带脊空气波导的缺陷,如不恒定的间隙高度,在带孔,以及带化学镀镍浸金(ENIG)涂层。为了验证所提出的SIGW,原型设计和制造使用多层印刷电路板(PCB)技术。它包含一个非常简单的SIGW和测量微带线之间的过渡。此外,实验结果表明,实测性能与模拟吻合良好。
To miniaturize the conventional air gap waveguide (GW), a substrate integrated gap waveguide (SIGW) is proposed. Moreover, SIGW makes up the defects in the microstrip-ridge air GW, such as inconstant gap height, holes in strip, as well as strip electroless nickel immersion gold (ENIG) coating. To verify the proposed SIGW, a prototype was designed and manufactured using the multi-layer printed circuit board (PCB) technology. It contains a very simple transition between SIGW and microstrip lines for measurements. Further, the experimental results show that the measured performance agrees well with the simulated.