UV light-induced deposition of low dielectric constant organic polymer for interlayer dielectrics
UV light-induced deposition of low dielectric constant organic polymer for interlayer dielectrics
复制标题
用于层间电介质的低介电常数有机聚合物的紫外光诱导沉积
DOI：
10.1016/s0925-3467(97)00109-2
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发表时间：
1998
影响因子：
3.9
通讯作者：
I. Boyd
中科院分区：
文献类型：
--
作者：
Jun;I. Boyd
本文叙述了在低温下用Xe_2准分子灯172 nm的光辐射将聚酰胺酸旋涂在Si和石英衬底上转变成聚酰亚胺薄膜的过程。利用傅里叶变换红外光谱研究了聚酰亚胺薄膜在不同曝光时间和温度下的紫外光固化过程中的酰亚胺化程度。与传统的炉处理相比，聚酰亚胺的光诱导固化提供了减少的处理时间和温度。椭圆偏振法，紫外分光光度法，电容-电压和电流-电压测量表征的聚合物膜，并表示它们是高品质的。特别是，电流-电压测量结果表明，照射的聚合物的漏电流密度是在一个数量级上小于已获得的层中制备的热处理。
The photo-induced conversion of polyamic acid spun onto Si and quartz substrates into thin polyimide films at low temperature using 172 nm radiation from a Xe2∗excimer lamp is described. The degree of imidization of the polyimide films during the UV curing at different exposure times and temperatures was investigated using Fourier transform infrared spectroscopy. Compared with conventional furnace processing, the photo-induced curing of the polyimide provided both reduced processing time and temperature. Ellipsometry, UV spectrophotometry, capacitance-voltage and current-voltage measurements were employed to characterize the polymer films and indicated them to be of high quality. In particular, the current-voltage measurements showed that the leakage current density of the irradiated polymer was over an order of magnitude smaller than has been obtained in layers prepared by thermal processing.