Strength Evaluation of Electronic Plastic Packages Using Stress Intensity Factors of V-Notch
Strength Evaluation of Electronic Plastic Packages Using Stress Intensity Factors of V-Notch
复制标题
利用 V 型缺口应力强度因子评估电子塑料封装的强度
DOI：
10.3970/cmes.2000.001.091
复制
发表时间：
2000
影响因子：
2.4
通讯作者：
N. Miyazaki
中科院分区：
文献类型：
--
作者：
T. Ikeda;Isao Arase;Yuya Ueno;N. Miyazaki
在电子设备中，接合的异种材料的角部存在于塑料树脂与管芯焊盘或芯片之间。塑料树脂的失效往往是在组装过程中或产品运行过程中从这些角落引起的。角部的强度评估对于防止塑料包装件的失效具有重要意义。为了计算拐角处的奇异应力场，我们利用了不同材料连接拐角处的渐近解的应力强度因子。我们表明，准确的应力强度因子可以分析的位移外推法使用从有限元方法得到的位移，由此产生的应力强度因子可以用于电子设备中的角的强度的评估。关键词：断裂力学，应力强度因子，拐角，电子封装
In electronic devices, the corners of joined dissimilar materials exist between plastic resin and a die pad or a chip. Failure of the plastic resin is often caused from these corners during the assembly process or the operation of products. The strength evaluation of the corner is important to protect the failure of plastic packages. To evaluate the singular stress field around a corner, we utilize the stress intensity factors of the asymptotic solution for a corner of joined dissimilar materials. We show that the accurate stress intensity factor can be analyzed by the displacement extrapolation method using the displacement obtained from the finite element method, and the resulting stress intensity factor can be utilized for the evaluation of the strength of the corner in electronic devices. keyword: fracture mechanics, stress intensity factor, corner, electronic packaging