Design of porous silica from hybrid organic–inorganic precursors
Design of porous silica from hybrid organic–inorganic precursors
复制标题
利用有机-无机杂化前体设计多孔二氧化硅
DOI：
10.1039/a801407h
复制
发表时间：
1998
影响因子：
3.3
通讯作者：
M. C. M. Man
中科院分区：
文献类型：
--
作者：
P. Chevalier;R. Corriu;P. Delord;J. Moreau;M. C. M. Man
制备了含有不稳定桥联有机单元的有机-无机杂化硅基材料。在非常温和的条件下，以少量氟离子(2%)为催化剂，在室温下可以消除有机碎片。将化学处理后得到的二氧化硅与牺牲法(600℃空气中氧化)得到的二氧化硅进行了比较。Si-C键的温和断裂消除了有机单元，生成了孔径分布非常窄(45A)的介孔二氧化硅。相比之下，高温空气氧化得到了孔径分散较宽的微孔二氧化硅。孔的大小和消除的有机分子的大小之间有很大的差异。由于化学消除和牺牲氧化途径导致的二氧化硅中的孔的大小也不同。在消除有机分子的过程中，发生了杂化网络的重排以形成纯二氧化硅网络。
Hybrid organic-inorganic silica-based materials containing a labile bridging organic unit have been prepared. The elimination of the organic fragment is possible under very mild conditions at room temperature in the presence of a small amount (2%) of fluoride ion as catalyst. The silicas obtained after chemical treatment have been compared with those obtained by a sacrificial route (oxidation at 600°C in air). The mild cleavage of Si–C bonds eliminates the organic units and generates mesoporous silicas with a very narrow pore size distribution (45 A). In contrast, the high temperature air oxidation gave a microporous silica with a wide dispersion of pore diameters. There is a big difference between the sizes of the pores and the size of the organic molecule eliminated. A discrepancy between the sizes of the pores in silicas resulting from the chemical elimination and the sacrificial oxidation route is also observed. A rearrangement of the hybrid network to form a pure silica network takes place during the elimination of the organic moities.
影响因子：
15
作者：
SHEA, KJ;LOY, DA;WEBSTER, O
通讯作者：
WEBSTER, O