Microstructures of (Ti,Cr,Al,Si)N films synthesized by cathodic arc method
Microstructures of (Ti,Cr,Al,Si)N films synthesized by cathodic arc method
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DOI：
10.1016/j.surfcoat.2006.07.016
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发表时间：
2007-02
影响因子：
5.4
通讯作者：
K. Ichijo;H. Hasegawa;Tetsuya Suzuki
中科院分区：
文献类型：
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作者：
K. Ichijo;H. Hasegawa;Tetsuya Suzuki
(Ti采用TiCrAlSi合金阴极，用阴极电弧法在WC和Si基体上沉积了（Cr，Al，Si）N薄膜。在较低的（Al+Si）含量（0.56 ~ 0.60）下，（Ti，Cr，Al，Si）N的晶体结构为NaCl型立方结构。随着（Al+Si）含量的增加，NaCl结构向六方结构转变。当（Si+Al）含量为0.56时，（Ti，Cr，Al，Si）N的硬度最大，为31 GPa。对应于从NaCl到纤锌矿的结构变化，显微硬度下降到26 GPa。TEM照片表明，Si原子的嵌入使晶粒尺寸减小了5-10 nm。通过X射线衍射和透射电子显微镜分析，讨论了Si、Al含量对显微组织和硬度的影响。
(Ti,Cr,Al,Si)N films were deposited on WC and Si substrate by cathodic arc method with TiCrAlSi alloy cathodes. At lower (Al+Si) contents from 0.56 to 0.60, the crystal structure of (Ti,Cr,Al,Si)N had NaCl type cubic structure. With increasing (Al+Si) contents, the NaCl structure changed to a hexagonal structure. The maximum hardness of (Ti,Cr,Al,Si)N was 31 GPa at 0.56 of (Si+Al) contents. Corresponding with structural changes from NaCl to wurtzite, microhardness decreased down to 26 GPa. TEM photographs indicated that embedding Si atom was effective to decreased grain sizes of 5–10 nm. In this paper, relationships between microstructure and microhardness as a function of Si and Al contents are discussed based on the phase transformation, analyzed by X-ray diffraction method and transmission electron microscopy.