Thermally Stable, Low Loss Optical Silicones: A Key Enabler for Electro-Optical Printed Circuit Boards
Thermally Stable, Low Loss Optical Silicones: A Key Enabler for Electro-Optical Printed Circuit Boards
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热稳定、低损耗光学有机硅:电光印刷电路板的关键推动者
DOI:
10.1109/jlt.2014.2358794
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发表时间:
2015
影响因子:
4.7
通讯作者:
F. Betschon
中科院分区:
文献类型:
--
作者:
R. John;Chad Amb;Brandon W. Swatowski;W. Weidner;M. Halter;T. Lamprecht;F. Betschon
We report the development and characterization of a low loss polymer waveguide material with a polysiloxane backbone for enabling the new generation electrooptical printed circuit boards (PCBs). The polymer was designed to have low optical loss of <;0.05 dB/cm at 850 nm and low residual stress to withstand the harsh reliability requirements during PCB integration. The thermomechanical properties of the polymer were tuned to exhibit a residual stress of ~1 MPa over a temperature range of 25 °C to 200 °C in ambient air. Multimode polymer waveguides were fabricated using the polysiloxane polymer and embedded in a six-layer PCB architecture that was subjected to lamination, through-hole via drilling, plating, and IPC shock test (immersion) in solder bath at 288 °C. Eight channels of multimode polymer waveguide spirals of length 1.2 m were fabricated and the insertion loss measured after waveguide fabrication, lamination, and solder reflow. The deviation in insertion loss as a function of the PCB fabrication process was less than 3% with final insertion loss after solder reflow being 0.052 +/- 0.002 dB/cm. This finding presents an optical waveguide material which when embedded in a PCB fabricated using an industry standard process meets reliability requirements while maintaining optical performance.