Active metal brazing of silicon nitride ceramics using a Cu-based alloy and refractory metal interlayers
Active metal brazing of silicon nitride ceramics using a Cu-based alloy and refractory metal interlayers
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DOI：
10.1016/j.ceramint.2015.12.087
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发表时间：
2016-03-01
影响因子：
5.2
通讯作者：
Valera, F. M.
中科院分区：
文献类型：
--
作者：
Martinez Fernandez, J.;Asthana, R.;Valera, F. M.
具有难熔金属（W 和 Mo）夹层的氮化硅/氮化硅接头采用活性钎料 Cu-ABA (Cu-3Si-2Al-2.25Ti，wt%) 和双搭接偏移配置中的两种夹层排列进行真空钎焊：Si3N4/Cu-ABA/W/Cu-ABA/Mo/Cu-ABA/Si3N4 和 Si3N4/Cu-ABA/Si3N4。钛在 Si3N4/Cu-ABA 和 Mo/Cu-ABA 界面偏析，但在 W/Cu-ABA 界面不偏析。 Si3N4/Cu-ABA/Si3N4 和 Si3N4/Cu-ABA/W/Cu-ABA/Mo/Cu-ABA/Si3N4 接头的室温压缩剪切强度值分别为 118 +/- 24 MPa 和 22 +/- 5 MPa。高温压缩试验表明，Si3N4/Cu-ABA/Si3N4 接头在 1023 K 时的强度为 31 +/- 6 MPa，在 1073 K 时为 17 +/- 3 MPa。同样，Si3N4/Cu-ABA/W/Cu-ABA/Mo/Cu-ABA/Si3N4 接头在 1023 K 时的强度为 19 +/- 4 MPa，在 13 +/- 3 MPa 时1073 K。努氏显微硬度分布显示了接头处的硬度梯度。讨论了接头微观结构和测试配置对机械行为的影响。 (C) 2015 Elsevier Ltd 和 Techna Group S.r.l.版权所有。
Silicon nitride/silicon nitride joints with refractory metal (W and Mo) interlayers were vacuum brazed using an active braze, Cu-ABA (Cu-3Si-2Al-2.25Ti, wt%), and two interlayer arrangements in a double-lap offset configuration: Si3N4/Cu-ABA/W/Cu-ABA/Mo/Cu-ABA/Si3N4 and Si3N4/Cu-ABA /Si3N4. Titanium segregated at the Si3N4/Cu-ABA and Mo/Cu-ABA interfaces, but not at the W/Cu-ABA interface. The room-temperature compression-shear strength values of Si3N4/Cu-ABA/Si3N4 and Si3N4/Cu-ABA/W/Cu-ABA/Mo/Cu-ABA/Si3N4 joints were 118 +/- 24 MPa and 22 +/- 5 MPa, respectively. Elevated-temperature compression tests showed that Si3N4/Cu-ABA/Si3N4 joints had strength of 31 +/- 6 MPa at 1023 K and 17 +/- 3 MPa at 1073 K. Likewise, Si3N4/Cu-ABA/W/Cu-ABA/Mo/Cu-ABA/Si3N4 joints had strength of 19 +/- 4 MPa at 1023 K and 13 +/- 3 MPa at 1073 K. Knoop microhardness profiles revealed hardness gradients across the joints. The effect of joint microstructure and test configuration on the mechanical behavior is discussed. (C) 2015 Elsevier Ltd and Techna Group S.r.l. All rights reserved.