Thermal Shock Behavior of Isotropic and Anisotropic Porous Silicon Nitride
Thermal Shock Behavior of Isotropic and Anisotropic Porous Silicon Nitride
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DOI：
10.1111/j.1151-2916.2003.tb03367.x
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发表时间：
2003-04
影响因子：
3.9
通讯作者：
J. She;Jianfeng Yang;D. Jayaseelan;N. Kondo;T. Ohji;S. Kanzaki;Y. Inagaki
中科院分区：
文献类型：
--
作者：
J. She;Jianfeng Yang;D. Jayaseelan;N. Kondo;T. Ohji;S. Kanzaki;Y. Inagaki
采用水淬技术研究了各向同性和各向异性多孔氮化硅的热震行为。裂纹萌生的临界温差被发现是强烈依赖于断裂强度与弹性模量的比值。各向异性多孔Si3N4由于具有很高的断裂应变，即使在1400°C的淬火温差下也没有出现宏观裂纹，并且能够保持其强度
The thermal shock behavior of isotropic and anisotropic porous Si 3 N 4 was evaluated using the water-quenching technique. The critical temperature difference for crack initiation was found to be strongly dependent on the ratio of fracture strength to elastic modulus. Because of a very high strain-to-failure, anisotropic porous Si 3 N 4 showed no macroscopic cracks and was able to retain its strength even at a quenching-temperature difference of ∼1400°C.