Unpowered opens test with X-ray laminography
Unpowered opens test with X-ray laminography
复制标题
无动力打开 X 射线断层扫描测试
DOI：
10.1109/test.1997.639625
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发表时间：
1996
期刊：
影响因子：
--
通讯作者：
S. Oresjo
中科院分区：
文献类型：
--
作者：
S. Oresjo
它显示了x射线层析成像可以用来检测焊料开口。用这种方法拍摄被测设备（DUT）的x射线图像。焊料中的铅含量使焊点在图像中清晰可见。利用图像处理算法和校准信息，将捕获的焊点图像自动转换为焊点的关键机械测量值，如脚跟高度、中心高度、脚趾高度、平均高度、脚趾和脚跟的圆角长度和宽度。这种方法的一个重要特点是，图像处理器利用焊点的这些机械特性，自动地从良好的焊点中判断出开放的焊点。所有引脚，包括VCC和接地，几乎所有组件类型，包括旁路电容器，都可以检查开路和边缘开路。通常可以检查PCB上98%以上的焊点。
It is shown how X-ray laminography can be used to detect solder opens. With this method X-ray images are taken of the device under test (DUT). The lead content in solder makes the solder joints appear clearly in the image. Using image processing algorithms and also calibration information, the captured image of the solder joint is automatically translated into key mechanical measurements of the solder joint, such as heel height, center height, toe height, average height, fillet length and width at the toe and the heel. An important feature of this method is that these mechanical characteristics of the solder joint are used by the image processor to automatically determine an open solder joint from a good solder joint. All pins, including VCC and grounds, almost all component types, including bypass capacitors, can be inspected for opens as well as marginal opens. Typically over 98% of all solder joints on a PCB can be inspected.