CONTINUOUS GROWTH-MODEL FOR INTERFACE MOTION DURING ALLOY SOLIDIFICATION

CONTINUOUS GROWTH-MODEL FOR INTERFACE MOTION DURING ALLOY SOLIDIFICATION
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DOI:
10.1016/0001-6160(88)90333-1
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发表时间:
1988-08-01
期刊:
ACTA METALLURGICA
影响因子:
--
通讯作者:
KAPLAN, T
KAPLAN, T
中科院分区:
其他
文献类型:
--
作者:
AZIZ, MJ;KAPLAN, T

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