Computational study of external fixation devices surface heating in MRI RF environment

Computational study of external fixation devices surface heating in MRI RF environment
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MRI射频环境下外固定装置表面加热的计算研究

DOI:
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发表时间:
2012
期刊:
IEEE International Symposium on Electromagnetic Compatibility
影响因子:
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通讯作者:
Ji Chen
Ji Chen
中科院分区:
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文献类型:
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作者:
Yan Liu;Jianxiang Shen;W. Kainz;Songsong Qian;Wen Wu;Ji Chen

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针对 1.5-T 和 3-T MRI 系统,对 MRI 射频场下外固定装置的热效应进行了数值研究。研究发现,改变插入深度和引脚间距会在很大程度上影响表面加热水平。在1.5T MRI中,较小的插入深度和较大的针间距会产生较大的温升。然而,对于3T系统,当插入深度大于5cm或引脚间距大于20cm时,关系不是很清楚。研究了连接杆材料对外固定器的影响,并分析了该装置的加热机理。
Heating effect by external fixation devices under MRI RF field was studied numerically for both 1.5-T and 3-T MRI systems. It is found that changing insertion depth and pin spacing could largely affect the surface heating level. In 1.5-T MRI, smaller insertion depth and larger pin spacing will produce larger temperature rise. However, for 3T system, the relation is not very clear when insertion depth became larger than 5cm or when pin spacing became larger than 20cm. Effect of connection bar material on external fixator is also studied and the heating mechanism of the device is analysed.