Real Time Synchrotron X-Ray Imaging for Nucleation and Growth of Cu6Sn5 in Sn-7Cu-0.05Ni High Temperature Lead-Free Solder Alloys
Real Time Synchrotron X-Ray Imaging for Nucleation and Growth of Cu6Sn5 in Sn-7Cu-0.05Ni High Temperature Lead-Free Solder Alloys
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DOI：
10.4028/www.scientific.net/amr.626.200
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发表时间：
2012-12
期刊：
影响因子：
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通讯作者：
K. Nogita;H. Yasuda;S. McDonald;K. Uesugi
中科院分区：
文献类型：
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作者：
K. Nogita;H. Yasuda;S. McDonald;K. Uesugi
本文阐述了在SPring-8同步加速器上进行实时凝固观察的最新进展对Sn-7wt%Cu-0.05wt%Ni高温无铅焊料合金的发展所起的作用。已经提出了组成范围为Sn-0.7至7.6wt%Cu的无铅焊料合金，其由共晶Sn-Cu 6Sn 5基质中的初级Cu 6Sn 5组成，作为在高达400°C的温度下用于组装高电流半导体的焊料。结果表明，微量的Al对焊料的微观结构有显着的影响，并细化初级Cu 6Sn 5的尺寸。使用X射线同步加速器观测实时观察导致细化的凝固途径。
This paper demonstrates how recent progress for real-time solidification observation at SPring-8 synchrotron has contributed to the development of Sn-7wt%Cu-0.05wt%Ni high temperature lead-free solder alloys. Lead-free solder alloys in the composition range Sn-0.7 to 7.6wt%Cu that consist of primary Cu6Sn5 in a eutectic Sn-Cu6Sn5 matrix have been proposed as solders for application at temperatures up to 400°C for the assembly high current semiconductors. It is shown that trace levels of Al have a marked effect on the solder microstructure and refine the size of the primary Cu6Sn5. The solidification pathway that leads to the refinement was observed in real-time using X-ray synchrotron observations.