Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
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高密度电流作用下银纳米粒子互连线的损伤分析
DOI：
10.1115/1.4053365
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发表时间：
2022
期刊：
影响因子：
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通讯作者：
Kazuhiro Fujisaki
中科院分区：
文献类型：
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作者：
Daiki Saito;Kazuhiko Sasagawa;Takeshi Moriwaki;Kazuhiro Fujisaki
印刷电子（PE）已经吸引了人们对微尺度电子电路制造的关注。PE使用包含金属纳米颗粒的导电油墨。导电油墨可以使用喷墨打印机和卷对卷方法印刷在用于可穿戴设备的柔性基底上。随着电子器件尺寸的缩小，器件线内电流密度和焦耳热增大，电迁移损伤变得显著。电磁场是金属原子在高密度电流作用下由电子风引起的一种输运现象。减少电磁损伤对于提高器件的可靠性是非常重要的。随着金属纳米颗粒墨水线小型化的进展，需要解决EM问题以确保这些线的可靠性。我们知道，聚集体的形成和阴极损坏是由于电流负载而发生的。在高密度电流加载下，由于EM引起的原子扩散路径尚未确定。在这项研究中，高密度的电流负载施加到银纳米粒子线。使用剥离法制备线试样。在电流负载试验后，使用激光显微镜和扫描电子显微镜进行观察。由于高密度电流的加载，线厚度和鳞片状狭缝状空隙的局部减少。此外，通过增大Ag晶粒来改善线的组织。从结果中，我们发现，一个占主导地位的扩散发生在银晶界由于EM。
Printed electronics (PEs) have attracted attention for the fabrication of microscale electronic circuits. PEs use conductive inks which include metal nanoparticles. The conductive ink can be printed on flexible substrates for wearable devices using ink-jet printers and roll-to-roll methods. With the scaling down of electric devices, the current density and Joule heating in the device lines increase, and electromigration (EM) damage becomes significant. EM is a transportation phenomenon of metallic atoms caused by the electron wind under high-density current. Reducing the EM damage is extremely important to enhance the device reliability. With the progress in miniaturization of the metal nanoparticle ink lines, EM problem needs to be solved for ensuring the reliability of these lines. We know that the formation of aggregates and cathode damages occur due to a current loading. The diffusion path of atoms due to the EM has not been identified under the high-density current loading. In this study, a high-density electric current loading was applied to an Ag nanoparticle line. The line specimens were prepared using a lift-off method. After the current loading tests, observations were conducted using a laser microscope and scanning electron microscope. A local decrease in the line thickness and scale-shaped slit-like voids were observed due to the high-density current loading. Moreover, the microstructure of the line was modified by enlarging the Ag grain. From the results, we identified that a dominant diffusion occurred at the Ag grain boundary due to the EM.