evelopment of evaluation method of heat resistance of ternary UV curable resin for stereolithography by photo rheometer
evelopment of evaluation method of heat resistance of ternary UV curable resin for stereolithography by photo rheometer
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光流变仪评价光固化三元光固化树脂耐热性方法的研制
DOI:
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发表时间:
2019
期刊:
影响因子:
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通讯作者:
Kentaro Taki
中科院分区:
文献类型:
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作者:
Ayumi Nishimura;Ken Tanaka;Hiroshi Yamamoto;Kentaro Taki