Experimental and Theoretical Studies of Serpentine Interconnects on Ultrathin Elastomers for Stretchable Electronics
Experimental and Theoretical Studies of Serpentine Interconnects on Ultrathin Elastomers for Stretchable Electronics
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DOI：
10.1002/adfm.201702589
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发表时间：
2017-10-05
影响因子：
19
通讯作者：
Rogers, John A.
中科院分区：
文献类型：
--
作者：
Pan, Taisong;Pharr, Matt;Rogers, John A.
将可变形互连与无机功能材料集成为高性能可拉伸电子产品开辟了道路。许多应用要求这些系统在重复载荷下承受大的变形。在这篇手稿中，弹性基板的蛇形互连线的拉伸性能的影响进行了理论和实验研究。有限元分析（FEA）揭示了随着基底厚度的减小，弹性拉伸性显著增加。低周疲劳试验通过检查形成与塑性变形相关的疲劳裂纹所需的拉伸来证实这一趋势。为了阐明这一现象的机制，变形蛇形互连的屈曲行为的基板上的各种厚度的检查。分析模型和有限元模拟表明，在基板的临界厚度以下，屈曲模式从局部屈曲变为全局屈曲。扫描电子显微镜和三维光学轮廓仪的研究证实了这种转变的屈曲行为。在薄衬底中发现的全局屈曲在蛇形物的塑性变形之前容纳大的拉伸，从而大大提高这些系统的可拉伸性。
Integrating deformable interconnects with inorganic functional materials establishes a path to high-performance stretchable electronics. A number of applications demand that these systems sustain large deformations under repetitive loading. In this manuscript, the influence of the elastomeric substrate on the stretchability of serpentine interconnects is investigated theoretically and experimentally. Finite element analyses (FEA) reveal a substantial increase in the elastic stretchability with reductions in substrate thickness. Low-cycle fatigue tests confirm this trend by examining the stretch required to form fatigue cracks associated with plastic deformation. To elucidate the mechanics governing this phenomenon, the buckling behaviors of deformed serpentine interconnects on substrates of various thicknesses are examined. The analytical model and FEA simulations suggest a change in the buckling mode from local wrinkling to global buckling below a critical thickness of the substrate. Scanning electron microscope and 3D optical profiler studies verify this transition in buckling behavior. The global buckling found in thin substrates accommodates large stretching prior to plastic deformation of the serpentines, thereby drastically enhancing the stretchability of these systems.