Why optical lithography will live forever
Why optical lithography will live forever
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DOI：
10.1116/1.1619954
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发表时间：
2003-11-01
影响因子：
1.4
通讯作者：
Brunner, TA
中科院分区：
文献类型：
--
作者：
Brunner, TA
能够制造现有技术芯片的光刻工艺面临许多困难的挑战。该工艺不仅必须解决最小特征尺寸，而且重叠误差必须保持在严格的公差范围内，必须以高产量印刷精美复杂的图案，并且该工艺的总成本必须是可接受的。使用昂贵的曝光工具实现可接受的芯片成本与高产量密切相关，而这又与具有高灵敏度的抗蚀剂工艺相关。近年来，化学放大抗蚀剂工艺由于其高分辨率和优异的灵敏度而主导了最先进的生产。本文将考虑生产光刻的分辨率限制，曝光工具本身的分辨率限制和抗蚀剂工艺的分辨率限制。在生产过程中最重要的考虑因素是抗蚀剂工艺灵敏度和分辨率之间的权衡。将描述用于制造集成电路的光刻术成功的根本原因。这些考虑将阐明未来光刻方法的挑战和机遇。(C)2003年美国真空学会。
A lithographic process capable of manufacturing state of the art chips faces many difficult challenges. Not only must the process resolve the minimum feature size but overlay errors must be held to tight tolerances, exquisitely complex patterns must be printed with high yield, and the overall cost of the process must be acceptable. Achieving acceptable chip cost using an expensive exposure tool is strongly linked to high throughput, and this in turn is linked to resist processes with high sensitivity. In recent years, chemically amplified resist processes have dominated state-of-the-art production because of their high resolution and excellent sensitivity. This article will consider limitations of resolution for production lithography, both the resolution limits of the exposure tool itself and the resolution limits of the resist process. Among the most important considerations for production processes is the tradeoff between resist process sensitivity and resolution. Fundamental reasons underlying the success of optical lithography for manufacturing integrated circuits will be described. These considerations will illuminate the challenges and opportunities for future lithographic methods. (C) 2003 American Vacuum Society.