High-speed creep process mediated by rapid dislocation absorption in nanocrystalline Cu
High-speed creep process mediated by rapid dislocation absorption in nanocrystalline Cu
复制标题
纳米晶铜中快速位错吸收介导的高速蠕变过程
DOI:
10.1063/1.3694005
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发表时间:
2012-03
影响因子:
3.2
通讯作者:
Jiang, Qing
中科院分区:
文献类型:
--
作者:
Mu, Junwei;Jiang, Zhonghao;Zheng, Weitao;Tian, Hongwei;Lian, Jianshe;Jiang, Qing
A high-speed creep process mediated by rapid dislocation absorption was found in the nanoindentation creep test on nanocrystalline Cu. The creep strain and creep strain rate depend strongly on the loading strain rate and are far higher than those predicted by the models of Coble creep and thermally activated grain boundary sliding. Our analysis revealed that grain boundary dislocation sources can be activated and emitted dislocations from grain boundaries can be stored effectively at a high loading strain rate, but cannot at a low loading strain rate. The observed high-speed creep process is mediated mainly by the rapid absorptions of the stored dislocations and the dislocations newly nucleated during the holding period. An implication of our experimental finding is that dislocation structure in nanocrystalline metals is highly unstable and dislocation activity can proceed after loading and lead to a significant post-loading plasticity.
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影响因子:
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作者:
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通讯作者:
Yujie Wei;A. Bower;Huajian Gao
影响因子:
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作者:
Huang, P.;Wang, F.;Lu, T. J.
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影响因子:
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作者:
Shan, ZW;Stach, EA;Mao, SX
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影响因子:
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作者:
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B. Zhu;R. Asaro;P. Krysl;R. Bailey
DOI:
10.1016/s0921-5093(02)00238-1
发表时间:
2003-01
影响因子:
6.4
作者:
H. Conrad
通讯作者:
H. Conrad