Low-Temperature Oxidation-Free Selective Laser Sintering of Cu Nanoparticle Paste on a Polymer Substrate for the Flexible Touch Panel Applications
Low-Temperature Oxidation-Free Selective Laser Sintering of Cu Nanoparticle Paste on a Polymer Substrate for the Flexible Touch Panel Applications
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DOI：
10.1021/acsami.5b12714
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发表时间：
2016-05-11
影响因子：
9.5
通讯作者：
Ko, Seung Hwan
中科院分区：
文献类型：
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作者：
Kwon, Jinhyeong;Cho, Hyunmin;Ko, Seung Hwan
铜纳米材料虽然具有巨大的成本效益，但存在严重的氧化问题。从化学、电学和表面形貌等方面比较了传统管炉加热和选择性激光烧结两种工艺对纳米铜颗粒浆料的影响。采用SEM、XRD、FT-IR和XPS等分析方法，比较了激光和炉法制备的铜薄膜的热行为。选择性激光烧结工艺保证了辉光退火温度，加工速度快，即使在空气环境中也具有显著的抗氧化性，而传统的管式炉加热即使在氩气环境中也会发生适度的氧化。此外，激光烧结的纳米铜薄膜具有良好的电性能，并且比传统的热加热工艺具有更低的氧化性。因此，所提出的选择性激光烧结工艺可以与塑料基板兼容，用于铜基柔性电子应用。
Copper nanomaterials suffer from severe oxidation problem despite the huge cost effectiveness. The effect of two different processes for conventional tube furnace heating and selective laser sintering on copper nanoparticle paste is compared in the aspects of chemical, electrical and surface morphology. The thermal behavior of the copper thin films by furnace and laser is compared by SEM, XRD, FT-IR, and XPS analysis. The selective laser sintering process ensures glow annealing temperature, fast processing speed with remarkable oxidation suppression even in air environment while conventional tube furnace heating experiences moderate oxidation even in Ar environment. Moreover, the laser-sintered copper nanoparticle thin film shows good electrical property and reduced oxidation than conventional thermal heating process. Consequently, the proposed selective laser sintering process can be compatible with plastic substrate for copper based flexible electronics applications.