Synthesis and Thermoelectric Properties of “Nano-Engineered” CoSb3 Skutterudite Materials

Synthesis and Thermoelectric Properties of “Nano-Engineered” CoSb3 Skutterudite Materials
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DOI:
10.1007/s11664-007-0160-2
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发表时间:
2007-06
影响因子:
2.1
通讯作者:
P. Alboni;X. Ji;Jian He;N. Gothard;J. Hubbard;T. Tritt
P. Alboni;X. Ji;Jian He;N. Gothard;J. Hubbard;T. Tritt
中科院分区:
工程技术4区
文献类型:
--
作者:
P. Alboni;X. Ji;Jian He;N. Gothard;J. Hubbard;T. Tritt

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方钴矿具有良好的电输运特性,被广泛研究作为潜在的下一代热电材料。进一步提高其热电性能的主要障碍之一是降低其相对较高的热导率。在某种程度上,这种阻碍已经通过用所谓的“嘎嘎作响”原子填充方钴矿结构中发现的空隙而部分解决。据预测,降低TE材料的维数将对增强其热电性能具有积极影响,例如增加热电势和降低热导率。因此,将纳米颗粒引入方钴矿材料中可能对其电性能产生有利的影响,并且还应该通过在整个样品中引入额外的散射中心来降低晶格热导率。纳米颗粒也可以与空隙填充结合使用,以进一步降低方钴矿的热导率。生长了具有不同量嵌入纳米颗粒的三锑化钴(CoSb 3)样品,并测量了这些复合材料从10 K到650 K的电和热输运性质。本文讨论了合成技术和电、热输运数据。
Because of their good electrical transport properties, skutterudites have been widely studied as potential next-generation thermoelectric (TE) materials. One of the main obstacles to further improving their thermoelectric performance has been reducing their relatively high thermal conductivity. To some extent, this hindrance has been partially resolved by filling the voids found in the skutterudite structure with so-called “rattling” atoms. It has been predicted that reducing the dimensionality in a TE material would have a positive effect in enhancing its thermoelectric properties, for example increasing the thermopower and reducing the thermal conductivity. Introducing nanoparticles into the skutterudite materials could therefore have favorable effects on their electrical properties and should also reduce lattice thermal conductivity by introducing extra scattering centers throughout the sample. Nanoparticles may also be used in conjunction with void filling for further reduction of the thermal conductivity of skutterudites. Cobalt triantimonide (CoSb3) samples with different amounts of embedded nanoparticles have been grown, and the electrical and thermal transport properties for these composites have been measured from 10 K to 650 K. The synthetic techniques and electrical and thermal transport data are discussed in this paper.