Determining the optimal PDMS-PDMS bonding technique for microfluidic devices
Determining the optimal PDMS-PDMS bonding technique for microfluidic devices
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DOI：
10.1088/0960-1317/18/6/067001
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发表时间：
2008-06-01
影响因子：
2.3
通讯作者：
Gale, Bruce K.
中科院分区：
文献类型：
--
作者：
Eddings, Mark A.;Johnson, Michael A.;Gale, Bruce K.
在过去几年中，随着对多层PDMS微流体器件的关注增加，文献中已经报道了许多聚二甲基硅氧烷（PDMS）键合技术。氧等离子体键合，尽管成本高，额外的制造时间和不一致的键合结果，仍然是一种广泛使用的方法，用于键合PDMS层。对四种快速、廉价的替代PDMS-PDMS键合方法进行了比较研究，以确定相对键合强度。这些包括电晕放电、部分固化、交联剂变化和未固化的PDMS粘合剂。部分固化和未固化的PDMS粘合剂通过保持超过600 kPa的平均粘合强度（其是氧等离子体的平均粘合强度的两倍以上）而展示出粘合强度和一致性的相当大的改善。每种技术的描述和它们的性能相对于氧等离子体键合包括在内。
A number of polydimethysiloxane (PDMS) bonding techniques have been reported in the literature over the last several years as the focus on multilayer PDMS microfluidic devices has increased. Oxygen plasma bonding, despite cost, additional fabrication time and inconsistent bonding results, has remained a widely used method for bonding PDMS layers. A comparative study of four rapid, inexpensive alternative PDMS-PDMS bonding approaches was undertaken to determine relative bond strength. These include corona discharge, partial curing, cross-linker variation and uncured PDMS adhesive. Partial curing and uncured PDMS adhesive demonstrated a considerable improvement in bond strength and consistency by retaining average bond strengths of over 600 kPa, which was more than double the average bond strength of oxygen plasma. A description of each technique and their performance relative to oxygen plasma bonding is included.