Investigating on Through Glass via based RF Passives for 3-D Integration
Investigating on Through Glass via based RF Passives for 3-D Integration
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研究用于 3D 集成的基于玻璃通孔的射频无源器件
DOI：
10.1109/jeds.2018.2849393
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发表时间：
2018
影响因子：
2.3
通讯作者：
Zhao Peiyi
中科院分区：
文献类型：
--
作者：
Qian Libo;Sang Jifei;Xia Yinshui;Wang Jian;Zhao Peiyi
由于低介电损耗和低成本，玻璃被开发为用于2.5-D和3-D集成中的高级中介层的有前途的材料。在本文中，通过玻璃通孔（TGV）来实现电感器的最小的足迹和大的品质因数。基于所提出的物理结构，不同的工艺和设计参数对TGV电感的电气特性的影响进行了研究与三维电磁仿真HFSS。据观察，TGV电感具有相同的电感和更大的品质因数相比，他们通过硅通孔对应。利用TGV电感和平行板电容，设计并分析了一种紧凑的三维带通滤波器。与一些报道的BPF相比，所提出的基于TGV的电路具有超紧凑的尺寸和优异的滤波性能。
Due to low dielectric loss and low cost, glass is developed as a promising material for advanced interposers in 2.5-D and 3-D integration. In this paper, through glass vias (TGVs) are used to implement inductors for minimal footprint and large quality factor. Based on the proposed physical structure, the impact of various process and design parameters on the electrical characteristics of TGV inductors is investigated with 3-D electromagnetic simulator HFSS. It is observed that TGV inductors have identical inductance and larger quality factor in comparison with their through silicon via counterparts. Using TGV inductors and parallel plate capacitors, a compact 3-D band-pass filter (BPF) is designed and analyzed. Compared with some reported BPFs, the proposed TGV-based circuit has an ultra-compact size and excellent filtering performance.