Deformable printed circuit boards that enable metamorphic electronics
Deformable printed circuit boards that enable metamorphic electronics
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DOI：
10.1038/am.2016.186
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发表时间：
2016-12-01
影响因子：
9.7
通讯作者：
Jacobs, Heiko O.
中科院分区：
文献类型：
--
作者：
Biswas, Shantonu;Schoeberl, Andreas;Jacobs, Heiko O.
报道了一种生产单层可变形和可拉伸印刷电路板的方法，并将其应用于实现可以呈现新的三维（3D）形状的变形电子产品。这些模型包含具有封装表面贴装器件和裸芯片的阵列，这些裸芯片将发光二极管（LED）和晶体管集成在橡胶基质中。测试结构从平面到球形再到锥形拓扑结构。在一种方法中，局部调整可拉伸印刷电路板的厚度以控制形态变化。此外，一个三维形状的伴侣被引入，使更突然的拓扑变化。对金属化层和应力消除增强元件的各种设计的比较研究确定了高度可拉伸和可变形的设计（高达315%或六千个150%拉伸和释放循环），其保护硬部件和不可拉伸部件之间的界面免受高水平的应力。
A method to produce single-layer deformable and stretchable printed circuit boards is reported and applied to enable the realization of metamorphic electronic products that can take on new three-dimensional (3D) shapes. The models contain arrays with packaged surface mount devices and bare dies that integrate light-emitting diodes (LEDs) and transistors within a rubber matrix. The test structures morph from planar to spherical to cone-like topologies. In one approach, the thickness of the stretchable printed circuit board is locally adjusted to control the morphological changes. In addition, a three-dimensionally-shaped chaperon is introduced to enable more abrupt topological changes. A comparative study of various designs of the metallization layer and stress-relieving reinforcing elements identified a highly stretchable and deformable design (up to 315% or six thousand 150% stretch and release cycles), which shields the interface between the hard and non-stretchable components from high levels of stress.