Recent advances in neural interfaces-Materials chemistry to clinical translation.
Recent advances in neural interfaces-Materials chemistry to clinical translation.
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DOI：
10.1557/mrs.2020.195
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发表时间：
2020-08
期刊：
影响因子：
5
通讯作者：
Voit W
中科院分区：
文献类型：
--
作者：
Bettinger CJ;Ecker M;Kozai TDY;Malliaras GG;Meng E;Voit W
植入式神经接口是加速神经科学研究和临床神经技术转化的重要工具。人类神经系统和计算机之间双向通信链接的前景令人信服，但必须首先解决重要的材料挑战，以提高植入式神经接口的可靠性。这一观点强调了与可植入神经接口的两种最常见的故障模式相关的最新进展和挑战：（1）受损的屏障层和包装导致电子元件故障;（2）由于有害的组织-生物材料相互作用导致的植入物的封装和排斥，这会侵蚀生物技术界面上信号的质量和带宽。创新的材料和设备设计概念可以解决这些故障模式，以提高设备性能，拓宽神经接口的转化前景。当代神经接口的简要概述，并随后在化学，材料和制造技术，以提高在体内的可靠性，包括新的屏障材料和协调的组织-设备接口的各种不一致的最新进展。还讨论了与神经接口的临床翻译相关的挑战和机遇。
Implantable neural interfaces are important tools to accelerate neuroscience research and translate clinical neurotechnologies. The promise of a bidirectional communication link between the nervous system of humans and computers is compelling, yet important materials challenges must be first addressed to improve the reliability of implantable neural interfaces. This perspective highlights recent progress and challenges related to arguably two of the most common failure modes for implantable neural interfaces: (1) compromised barrier layers and packaging leading to failure of electronic components; (2) encapsulation and rejection of the implant due to injurious tissue–biomaterials interactions, which erode the quality and bandwidth of signals across the biology–technology interface. Innovative materials and device design concepts could address these failure modes to improve device performance and broaden the translational prospects of neural interfaces. A brief overview of contemporary neural interfaces is presented and followed by recent progress in chemistry, materials, and fabrication techniques to improve in vivo reliability, including novel barrier materials and harmonizing the various incongruences of the tissue–device interface. Challenges and opportunities related to the clinical translation of neural interfaces are also discussed.
影响因子：
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作者：
Bettinger CJ;Kulig KM;Vacanti JP;Langer R;Borenstein JT
通讯作者：
Borenstein JT