A new method for measuring the strength and ductility of thin films
A new method for measuring the strength and ductility of thin films
复制标题
DOI：
10.1557/jmr.1993.1542
复制
发表时间：
1993-07
影响因子：
2.7
通讯作者：
D. Read;J. Dally
中科院分区：
文献类型：
--
作者：
D. Read;J. Dally
介绍了一种测量薄膜机械强度的新方法。我们使用半导体行业常见的沉积、图案化和蚀刻工艺制备了四个拉伸试样的微型阵列，每个拉伸试样宽0.25 mm，长1 mm，厚2.2 μm。每个阵列的四个标本进行和保护的矩形硅框架。36个这样的标本是在一个单一的晶圆生产。在安装样品架之后，在不损坏样品的情况下切断其垂直侧。通过一个特殊的张力弹簧，以测微计施加载荷。测定了2.2 μm厚Ti-Al-Ti薄膜的拉伸性能。
A new method of measuring the mechanical strength of thin films is described. We prepare miniature arrays of four tensile specimens, each 0.25 mm wide, 1 mm long, and 2.2 μm thick, using deposition, patterning, and etching processes common to the semiconductor industry. Each array of four specimens is carried on and protected by a rectangular silicon frame. Thirty-six such specimens are produced on a single wafer. After a specimen frame is mounted, its vertical sides are severed without damaging the specimens. The load is applied by micrometers through a special tension spring. Tensile properties of a 2.2 μm thick Ti–Al–Ti film were determined.