Structured Copper: A Pliable High Conductance Material for Bonding to Silicon Power Devices
Structured Copper: A Pliable High Conductance Material for Bonding to Silicon Power Devices
复制标题
结构化铜：一种用于粘合硅功率器件的柔韧高电导材料
DOI：
--
复制
发表时间：
1983
期刊：
影响因子：
--
通讯作者：
H. Webster
中科院分区：
文献类型：
--
作者：
H. Glascock;H. Webster
硅与高导电金属之间的热膨胀差异是大功率硅器件封装中需要解决的主要问题。一种解决方案是使用结构化铜，它由许多单独的铜线制成，可以直接连接到硅上而不会引入大的应力。沿着介绍了结构铜的制备方法及其应用实例。
The large difference in thermal expansion between silicon and the high conductivity metals is a major problem to be solved in the packaging of high power silicon devices. One solution is by the use of structured copper which is made of many separate copper wires and can he directly attached to silicon without introducing large stresses. Methods of preparing structured copper are presented along with some examples of its application.