Enhanced flow boiling heat transfer of FC-72 on micro-pin-finned surfaces
Enhanced flow boiling heat transfer of FC-72 on micro-pin-finned surfaces
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DOI：
10.1016/j.ijheatmasstransfer.2009.02.031
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发表时间：
2009-06
影响因子：
5.2
通讯作者：
A. Ma;Jinjia Wei;Minzhe Yuan;Jiabin Fang
中科院分区：
文献类型：
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作者：
A. Ma;Jinjia Wei;Minzhe Yuan;Jiabin Fang
为了有效冷却高热流密度电子元件，进行了FC-72在硅片上流动沸腾传热性能的实验研究。使用干法蚀刻技术在芯片表面制造微针翅片以增强沸腾传热。分别进行三种不同的流体速度（0.5、1和2m/s）和三种不同的液体过冷度（15、25和35K）。测试了一个光滑芯片（芯片S）和四个微型针翅片芯片，其翅片厚度相同为30μm，翅片高度不同为60μm（芯片PF30-60）和120μm（芯片PF30-120）。与光滑表面相比，所有微针翅片表面都表现出相当大的传热增强，并且临界热通量按芯片 S、PF30–60 和 PF30–120 的顺序增加。对于较低的翅片高度与翅片间距之比和/或较高的流体速度，流体速度对微针翅片表面的泡核沸腾曲线具有积极影响。当速度低于1m/s时，微针翅片表面的热通量随着壁面过热度的增加而急剧增加，临界热通量(CHF)处的壁温低于LSI芯片可靠运行的上限85°C。所有表面的 CHF 值都会随着流体速度和过冷度的增加而增加。对于PF30-120芯片，在流体速度为2m/s、液体过冷度为35K时，最大CHF可达到近150W/cm2。
For the purpose of cooling electronic components with high heat flux efficiently, some experiments were conducted to study the flow boiling heat transfer performance of FC-72 on silicon chips. Micro-pin-fins were fabricated on the chip surface using a dry etching technique to enhance boiling heat transfer. Three different fluid velocities (0.5, 1 and 2m/s) and three different liquid subcoolings (15, 25 and 35K) were performed, respectively. A smooth chip (chip S) and four micro-pin-finned chips with the same fin thickness of 30μm and different fin heights of 60μm (chip PF30–60) and 120μm (chip PF30–120), respectively, were tested. All the micro-pin-finned surfaces show a considerable heat transfer enhancement compared to the smooth one, and the critical heat flux increases in the order of chip S, PF30–60 and PF30–120. For a lower ratio of fin height to fin pitch and/or higher fluid velocity, the fluid velocity has a positive effect on the nucleate boiling curves for the micro-pin-finned surfaces. At the velocities lower than 1m/s, the micro-pin-finned surfaces show a sharp increase in heat flux with increasing wall superheat, and the wall temperature at the critical heat flux (CHF) is less than the upper limit, 85°C, for the reliable operation of LSI chips. The CHF values for all surfaces increase with fluid velocity and subcooling. The maximum CHF can reach nearly 150W/cm2for chip PF30–120 at the fluid velocity of 2m/s and the liquid subcooling of 35K.