Strong adhesion of polyvinylpyrrolidone-coated copper nanoparticles on various substrates fabricated from well-dispersed copper nanoparticle inks
Strong adhesion of polyvinylpyrrolidone-coated copper nanoparticles on various substrates fabricated from well-dispersed copper nanoparticle inks
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DOI：
10.1016/j.colsurfa.2020.124567
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发表时间：
2020-04
期刊：
影响因子：
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通讯作者：
S. Yokoyama;J. Nozaki;K. Motomiya;N. Tsukahara;Hideyuki Takahashi
中科院分区：
文献类型：
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作者：
S. Yokoyama;J. Nozaki;K. Motomiya;N. Tsukahara;Hideyuki Takahashi
在这项研究中，我们获得了铜纳米粒子（Cu NP）薄膜表现出低电阻率和强附着力相对于各种基板滴铸的Cu NP油墨与聚乙烯吡咯烷酮（PVP）后，在250 °C烧结。PVP在油墨中起到分散剂的作用，并在Cu纳米颗粒和基底之间的界面处起到粘合剂的作用。Cu NP在油墨中的聚集导致在滴铸之后产生多孔NP膜，并且PVP涂覆的Cu NP与基底之间的接触面积小，导致差的粘附性。Cu NP油墨的核磁共振（NMR）弛豫测量（其可以确定未稀释的Cu NP的分散性）揭示了需要长的分散时间和最佳的PVP浓度来产生具有PVP的良好分散的Cu NP油墨。良好分散的油墨导致致密的Cu NP膜和大的接触面积，表现出强粘附力。该油墨被施加到各种基板上，包括玻璃、聚酰亚胺、聚邻苯二甲酰胺、液晶聚合物和聚四氟乙烯，并且除了聚四氟乙烯之外，这些基板显示出强粘附性。聚四氟乙烯的弱粘附力可以归因于由于聚四氟乙烯的低表面能，PVP涂覆的Cu NPs和聚四氟乙烯基底之间的小表面能变化。具有PVP的良好分散的Cu NP油墨预期被应用于在用于印刷电子的各种基板上生产粘合剂Cu布线，除了表现出低表面能的基板如聚四氟乙烯。
In this study, we obtained copper nanoparticle (Cu NP) films exhibiting low resistivity and strong adhesion with respect to various substrates by drop-casting the Cu NP ink with polyvinylpyrrolidone (PVP) after being sintered at 250 °C. PVP functioned as a dispersant in the ink and as an adhesive at the interfaces between the Cu NPs and the substrates. Aggregation of the Cu NPs in the ink resulted in the creation of a porous NP film after drop-casting, and the contact area between the PVP-coated Cu NPs and the substrates was small, resulting in poor adhesion. The nuclear magnetic resonance (NMR) relaxation measurement of the Cu NP ink, which can determine the dispersibility of the undiluted Cu NPs, revealed that long dispersion time and optimal PVP concentration were required to produce a well-dispersed Cu NP ink with PVP. The well-dispersed ink resulted in dense Cu NP films and a large contact area, demonstrating strong adhesion. The ink was applied to various substrates, including glass, polyimide, polyphthalamide, liquid crystal polymer, and polytetrafluoroethylene, and these substrates, except polytetrafluoroethylene, showed strong adhesion. The weak adhesion of polytetrafluoroethylene can be attributed to the small surface energy change between the PVP-coated Cu NPs and the polytetrafluoroethylene substrate owing to the low surface energy of polytetrafluoroethylene. The well-dispersed Cu NP ink with PVP is expected to be applied to the production of adhesive Cu wiring on various substrates for printed electronics, except substrates exhibiting low surface energy such as polytetrafluoroethylene.