Subcritical debonding of polymer/silica interfaces under monotonic and cyclic loading
Subcritical debonding of polymer/silica interfaces under monotonic and cyclic loading
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DOI：
10.1016/s1359-6454(02)00072-1
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发表时间：
2002-05-24
期刊：
影响因子：
9.4
通讯作者：
Dauskardt, RH
中科院分区：
文献类型：
--
作者：
Snodgrass, JM;Pantelidis, D;Dauskardt, RH
界面化学和交变机械载荷对薄聚合物层从无机物中亚临界脱粘的影响对于一系列现代技术中使用的器件的完整性具有重要意义。然而，在聚合物界面处的亚临界脱粘生长的机制，特别是在循环载荷下，还没有很好地理解。这种亚临界脱粘的一个代表性的聚合物电介质（苯并环丁烯）的二氧化硅钝化的硅衬底下循环和单调加载在潮湿的环境中进行了研究。使用选定的氨基和乙烯基官能硅烷粘合促进剂的界面化学亚临界脱粘的效果进行了评估。在模式I和混合模式I/模式II加载下，表征了10（-3）-10（-9）m/s范围内的脱粘生长速率。AFM和XPS结果表明，BCB的失效模式是在非常接近界面的区域内聚。疲劳加载被发现显着加速亚临界脱粘增长率，产生疲劳条纹的条纹高度类似于1 -2纳米和间距，与脱粘增长率。提出了一个模型的条纹形成的机制。(C)2002 Acta Materialia Inc.由爱思唯尔科技有限公司出版。保留所有权利。
The effects of interface chemistry and alternating mechanical loads on subcritical debonding of thin polymer layers from inorganic dielectrics are of significant interest for the integrity of devices used in a range of modern technologies. However, the mechanisms of subcritical debond growth at polymer inter-faces, particularly under cyclic loads, are not well understood. Such subcritical debonding of a representative polymer dielectric (benzocyclobutene) to a silica-passivated silicon substrate was studied under cyclic and monotonic loading in moist environments. The effect of interface chemistry on subcritical debonding was evaluated using selected amino- and vinyl-functional silane adhesion promoters. Debond growth rates over the range of 10(-3)-10(-9) m/s were characterized under Mode I and mixed Mode I/Mode II loading. AFM and XPS results suggest that the failure mode of the BCB was cohesive in a region very close to the interface. Fatigue loading was found to significantly accelerate subcritical debond growth rates, producing fatigue striations with a striation height of similar to1-2 nm and a spacing that was correlated with the debond growth rate. A model is presented for the mechanism of striation formation. (C) 2002 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.